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Common Techniques of Magnetron Sputtering
DC magnetron sputtering: based on DC secondary sputtering, DC magnetron sputtering is used to protect the magnetic steel behind the target. It can be used to sputter and deposit conductive film, and the deposition speed is fast;
However, if the target is an insulator, the surface charge of the target will rapidly accumulate, which will result in the inability of sputtering. Therefore, DC magnetron sputtering is adopted for the sputtering of pure metal targets, such as SUS, Ag, Cr, Cu, etc.
Intermediate frequency magnetron sputtering is commonly used for reactive sputtering, such as metal oxides, carbides, etc. A small amount of reactive gases N2, O2, C2H2 and inert gas Ar2 are input into the vacuum chamber together, so that the reactive gas and target atoms are deposited on the substrate together.
For the coating or ceramic target made of some hard to find block materials, the film composition is easy to deviate from the original target composition after sputtering, which can also be improved by reactive deposition.
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